High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends
Abstract: The applications of wide bandgap (WBG) semiconductors represented by silicon carbide (SiC) and gallium nitride (GaN) in power modules are currently limited by the thermal stability of ...
Has AI coding reached a tipping point? That seems to be the case for Spotify at least, which shared this week during its fourth-quarter earnings call that the best developers at the company “have not ...
Abstract: Solid state circuit breaker (SSCB) with high efficiency and high gravimetric power density is required for Electrified Aircraft Propulsion (EAP). A cryogenically cooled GaN device based SSCB ...
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