Power modules handle heat, moisture, and high voltage while making design easier and reducing failures. Learn more about ...

A durable time‑to‑market advantage in hardware development comes from deliberately designing for scale from day one.

Rugged boards and modules were everywhere at this year’s Embedded World 2026. New form factors like VITA 93 QMC were on display along with those based on standards like COM Express. More boards and ...

What happens when edge computing runs entirely on performance cores? A modular platform hints at deterministic processing for ...

Star’ fire-resistant module at PV Expo Japan in Tokyo, the product meeting the world’s most stringent fire safety ...

Scalable Edge Performance for Demanding Applications SAN DIEGO, CA, UNITED STATES, March 13, 2026 /EINPresswire.com/ -- ...

ROHM Semiconductor today announced it has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase ...

Within three years, no embedded software developer is going to be writing code. I know it sounds like another one of my controversial statements. But I recently used Claude Code to write the best ...

Ready.YOURS Partner Program for market-specific system solutions SAN DIEGO, CA, UNITED STATES, March 13, 2026 /EINPresswire.com/ — March 10, 2026 * * * congatec – the leading provider of embedded and ...

Microchip Technology (Nasdaq: MCHP) today announces its BZPACK mSiC ® power modules, designed to meet stringent High Humidity High Voltage High Temperature Reverse Bias (HV-H3TRB) standards. The ...

Blended approaches that combine FEOC and non-FEOC compliant modules can help meet MACR thresholds while keeping costs low.

STMicroelectronics and Leopard Imaging accelerate robotics vision with NVIDIA Jetson-ready multi-sensor module ...