To allow real-time control of dielectric chemical mechanical planarization (CMP) processes to the 45 nm device node and beyond, Santa Clara, Calif.-based semiconductor manufacturing equipment leader ...

For decades, semiconductor manufacturers have used chemical-mechanical polishing (CMP) as the primary technique for the smoothing and leveling (planarization) of dielectrics and metal layers. CMP ...

ACM Research, a two-year-old Californian company, says it can see the end of the road for chemical mechanical polishing (CMP), and is looking to move in on the market with a non-contact process. It ...

Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in ...

Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...